xMEMS Labs of Santa Clara, Calif., plans to unveil its next-generation headphone architecture during an upcoming seminar series in Taipei, Taiwan and Shenzhen, China.
The new approach pairs Sycamore, a MEMS loudspeaker for headphones, with µCooling, the first air pump-on-a-chip, to deliver top-level audio and reduced moisture build-up. The result is promised to be a lighter, thinner, and more comfortable headphone, the company said.
Sycamore is a MEMS loudspeaker with solid state materials that is 98% smaller by volume and weighs 150 milligrams.That size frees up space inside the earcup for larger batteries or advanced PCBs and thinner designs. A single Sycamore speaker plate weighs 18 grams, compared to about 42 grams for a a conventional 50mm drive assembly.
Also, xMEMS is using its µCooling technology to headphones for a silent and vibration free active humidity control inside the earcup. Reducing moisture and maintaining optimal humidity helps xMEMS address heat and moisture buildup in over-ear headphone designs during extended listening. The XMC-2400 µCooling chip uses ultrasonic modulation to create pressure pulses for air movement. The airflow pulses at ultrasonic frequencies for silent operation. xMEMS won in the Best of MEMS category at Best of Sensors 2025, and was also named Best Startup at the event.
Demonstrations will occur at xMEMS Live 2025 in Taipei Sept. 16 and Shenzhen Sept. 18.