xMEMS Labs, Inc. emerged as the winner in the Best MEMS Solution category of the 2025 Best of Sensors Awards for its groundbreaking XMC-2400 µCooling fan-on-a-chip.
Questex’s Sensors Converge and Fierce Electronics announced the awards during a ceremony at the 40th annual Sensors Converge event in Santa Clara, CA. The awards recognize cutting-edge technologies and innovative companies across the sensors, electronics, and embedded systems landscape, with winners selected by a panel of industry judges based on innovation, market value, and problem-solving capabilities.
The XMC-2400 µCooling chip represents a fundamental breakthrough in thermal management for ultra-thin electronics. At just 9.26 x 7.6 x 1.08 millimeters and weighing less than 150 milligrams, this all-silicon device is the world’s first active cooling solution designed specifically for smartphones, tablets, and other thin mobile devices that have traditionally relied only on passive cooling methods. The chip addresses a critical challenge in modern electronics where devices have become thermal-limited rather than processing-limited, causing applications to throttle performance or shut down due to heat generation.
Built on the same piezoMEMS technology platform as xMEMS’ award-winning micro speakers, the XMC-2400 operates using ultrasonic modulation to create pressure pulses for air movement. The device functions as a voltage-controlled pump that generates airflow pulses at ultrasonic frequencies, making it completely silent during operation since all mechanical movement occurs outside the human hearing range. This innovative approach allows the chip to move up to 39 cubic centimeters of air per second with over 1,000 Pascals of back pressure, enabling it to push airflow through very narrow channels and ducts that would stall conventional fans.
The solid-state design offers several advantages over traditional cooling methods. With no moving parts like rotors or fins, the XMC-2400 provides semiconductor-level reliability and part-to-part uniformity. The device is IP58 rated for dust and moisture resistance and supports bi-directional airflow, meaning it can operate as either a blower or suction device depending on system requirements. Multiple chips can be arranged in arrays or stacked to increase airflow and back pressure for various applications.
Early testing results demonstrate the chip’s effectiveness in real-world scenarios. Thermal measurements show an average 26% reduction in thermal resistance, 20%-30% temperature reduction, and 36% increase in power headroom. A top-five smartphone manufacturer reported in their system thermal modeling that the XMC-2400 could reduce phone case temperature by 5°C, a significant improvement considering that reducing even 1°C is typically challenging in mobile device design.
When presenting the award, judges commented that the technology is “game changing in unlocking sustained performance in AI workloads and other heat-sensitive applications.” They noted that it “unlocks more capability for on-device compute without the limitations of thermal impact,” opening possibilities for miniaturizing compute-intensive technologies like AR and VR glasses.
The XMC-2400 is manufactured using production-proven piezoMEMS processes at two of the world’s leading high-volume MEMS fabrication facilities, the same foundries that produce xMEMS’ line of micro speakers. This manufacturing approach enables semiconductor-scale production, quality control, and cost efficiency. The chip supports automated surface mounting onto rigid or flexible printed circuit boards and interfaces with systems through a simple 3V input and I2C configuration.
Applications for the technology extend beyond consumer electronics. The company has verified interest in datacenter applications for spot cooling inside rack servers and optical networking components, automotive applications for cooling processors and ECUs, and use in autonomous drones, robotics, and security cameras. The chip began sampling to lead customers in February 2025, with mass production scheduled for Q4 2025.
xMEMS Labs, founded in 2018 and headquartered in Santa Clara, California, has established itself as a leader in piezoMEMS innovation with over 150 granted patents worldwide. The company initially focused on developing solid-state MEMS speakers for personal audio devices before expanding its technology platform to address thermal management challenges in ultra-thin electronics.
To discover the other companies providing innovative sensors and the complete list of 2025 Best of Sensors Award winners, visit this article.